GRINDING HEAD

Core Advantages
Key Parameters

Backside thining, front side grinding, and fine grinding of materials such as plastic encapsulant, Si wafers, and Sic wafers require clear patters and a surface free of scratches.Semiconductor wafer processing fields such as raw wafers, discrete devices, and integrated circuit substrates.

Core Advantages

Superior Sharpness

High-quality diamond abrasive combined with an exclusive formula delivers outstanding sharpness, ensuring a highly efficient and smooth edging process, which greatly improves overall processing efficiency.
Excellent Heat Dissipation & Chip Removal

The dense and uniform tooth structure guarantees sufficient cooling during edging, enables unobstructed chip discharge, and avoids processing quality defects caused by heat accumulation.
Premium Compatibility & Stability

It is fully compatible with double edging machines of all brands. Its structural design perfectly fits the equipment operation requirements, delivering exceptional running stability and more controllable processing accuracy during use.

Key Parameters

Mill diameter (D)	$200, Yu 246, 303 inside, 350 inside etc
Inner diameter (d)	$158, $190, $240, $274, etc.
Number of teeth (pcs)	28, 32, 69, etc.
Mesh (#)	320#~15000#
Processing object	6-inch, 8-inch, 10-inch wafers
Equipment speed (r)	25000-50000r/min
Feed rate (vf)	Roughness <4µm/s, fine <0.4µm/s
Grinding amount (ae)	Coarse <0.6mm, fine <0.03mm

Glass Processing Grinding Wheels

Semiconductor Processing

Display Glass Processing

For Machining Centers

GRINDING DISC

Core Advantages

Superior Sharpness

Excellent Heat Dissipation & Chip Removal

Premium Compatibility & Stability

Key Parameters