Single crystal silicon and silicon carbide wafer edge grinding and chamfering.Semiconductor wafer manufacturing field.
Core Advantages
Superior Sharpness
High-quality diamond abrasive combined with an exclusive formula delivers outstanding sharpness, ensuring a highly efficient and smooth edging process, which greatly improves overall processing efficiency.
Excellent Heat Dissipation & Chip Removal
The dense and uniform tooth structure guarantees sufficient cooling during edging, enables unobstructed chip discharge, and avoids processing quality defects caused by heat accumulation.
Premium Compatibility & Stability
It is fully compatible with double edging machines of all brands. Its structural design perfectly fits the equipment operation requirements, delivering exceptional running stability and more controllable processing accuracy during use.
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