GRINDING DISC

Core Advantages
Key Parameters

Suitable for processing precision electronic glass, ITO conductive film glass and other products, and adapts to high-speed edging machines with linear speed > 30m/s. Part of the products support secondary repair and regeneration, which can greatly reduce procurement costs.It is mainly used in the precision electronic glass substrate processing industry of float production lines and overflow method production lines.

Core Advantages

Superior Sharpness

High-quality diamond abrasive combined with an exclusive formula delivers outstanding sharpness, ensuring a highly efficient and smooth edging process, which greatly improves overall processing efficiency.
Excellent Heat Dissipation & Chip Removal

The dense and uniform tooth structure guarantees sufficient cooling during edging, enables unobstructed chip discharge, and avoids processing quality defects caused by heat accumulation.
Premium Compatibility & Stability

It is fully compatible with double edging machines of all brands. Its structural design perfectly fits the equipment operation requirements, delivering exceptional running stability and more controllable processing accuracy during use.

Key Parameters

Grinding Disc Diameter (D)	ø150 mm、ø200 mm
Mandrel Diameter (d)	ø25 mm、ø40 mm、ø50 mm、ø63.5 mm
Groove Type	Trapezoidal, U-shaped
Grit Size (#)	400#、600#、800#
Workpiece	0.25T, 0.5T, 0.7T, 1.1T thickness glass
Equipment Rotation Speed (r)	2500-6000 r/min
Feed Rate (vf)	6000-8000 mm/min
Grinding Depth (ae)	0.15-0.3 mm

Glass Processing Grinding Wheels

Semiconductor Processing

Display Glass Processing

For Machining Centers

GRINDING DISC

Core Advantages

Superior Sharpness

Excellent Heat Dissipation & Chip Removal

Premium Compatibility & Stability

Key Parameters