Meijie Superhard Materials – Precision Tools for Global Manufacturing.
Suitable for precision grinding of self-luminous chip display glass substrates. It can meet the high-precision requirements of grinding wheel eccentricity ≤5μm and chipping after grinding <15μm. The glass edge has excellent symmetry after processing, which can adapt to the high-quality splicing requirements of screens.Suitable for precision glass processing in new self-luminous high-end display fields such as Mini LED, Micro LED, and OLED rigid screens.

Core Advantages

  • Superior Sharpness

    Superior Sharpness

    High-quality diamond abrasive combined with an exclusive formula delivers outstanding sharpness, ensuring a highly efficient and smooth edging process, which greatly improves overall processing efficiency.
  • Excellent Heat Dissipation & Chip Removal

    Excellent Heat Dissipation & Chip Removal

    The dense and uniform tooth structure guarantees sufficient cooling during edging, enables unobstructed chip discharge, and avoids processing quality defects caused by heat accumulation.
  • Premium Compatibility & Stability

    Premium Compatibility & Stability

    It is fully compatible with double edging machines of all brands. Its structural design perfectly fits the equipment operation requirements, delivering exceptional running stability and more controllable processing accuracy during use.

Key Parameters

Grit Size (#)No specific value specified in the original document
WorkpieceNo specific specification specified in the original document
Equipment Rotation Speed (r)28000-60000 r/min
Feed Rate (vf)50-300 mm/min
Single Grinding Depth (ae)0.05-0.3 mm
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