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Home > Products > Semiconductor Processing > GRINDING HEAD
Suitable for semiconductor ceramic materials including alumina/zirconia/yttria, silicon carbide/silicon nitride, etc. It can be applied to processing operations such as peck drilling, hole grinding, hole reaming, and groove broaching.It can complete the processing and forming of components such as aluminum nitride nozzles, gas distribution discs, pump rings, Moore rings/bases, and is widely used in thin film deposition systems in the semiconductor field.

Core Advantages

  • Superior Sharpness

    Superior Sharpness

    High-quality diamond abrasive combined with an exclusive formula delivers outstanding sharpness, ensuring a highly efficient and smooth edging process, which greatly improves overall processing efficiency.
  • Excellent Heat Dissipation & Chip Removal

    Excellent Heat Dissipation & Chip Removal

    The dense and uniform tooth structure guarantees sufficient cooling during edging, enables unobstructed chip discharge, and avoids processing quality defects caused by heat accumulation.
  • Premium Compatibility & Stability

    Premium Compatibility & Stability

    It is fully compatible with double edging machines of all brands. Its structural design perfectly fits the equipment operation requirements, delivering exceptional running stability and more controllable processing accuracy during use.

Key Parameters

Grinding Head Diameter (D)ø0.5-ø5 mm
Shank Diameter (d)ø6 mm
Effective Length (H)2-20 mm
Grit Size (#)100#-600#
WorkpieceCeramic Materials
Equipment Rotation Speed (r)Not specified in the original document
Feed Rate (vf)Not specified in the original document
Grinding Depth (ae)0.005-0.02 mm
Zhenjiang Meijie Superhard Materials Co., Ltd.
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